Electronic apparatus

ABSTRACT

The present disclosure relates to an electronic apparatus. The electronic apparatus includes a base substrate, a first sensing electrode, and a second sensing electrode. A hole is defined through the base substrate. The first sensing electrode includes first sensing patterns and first connection patterns, which are arranged in a first direction. The second sensing electrode includes second sensing patterns and second connection patterns, which are arranged in the first direction. One first connection pattern and one second connection pattern are spaced apart from each other in a second direction with the hole defined therebetween. A first distance in the second direction between the one first connection pattern and the one second connection pattern is greater than a second distance in the second direction between another first connection pattern and another second connection pattern.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application claims priority under 35U.S.C. § 119 of Korean Patent Application No. 10-2019-0153441, filed onNov. 26, 2019, and to U.S. patent application Ser. No. 17/077,640 filedon Oct. 22, 2020, the contents of which are hereby incorporated byreference in their entirety.

BACKGROUND 1. Field of Disclosure

The present disclosure relates to an electronic apparatus. Moreparticularly, the present disclosure relates to an electronic apparatusprovided with a hole defined therethrough and sensing an external input.

2. Description of the Related Art

Smartphones, tablet computers, and smart watches are examples ofelectronic devices. These electronic devices contain various componentssuch as input sensors and electronic modules. In some cases, theseelectronic component may be susceptible to damage from electrostaticdischarge events.

Electrostatic discharge is a sudden flow of electricity through twoelectronic devices when the two electronic devices come in contact.Electrostatic discharge may follow a buildup of static charge. Thebuildup of static energy may then be passed through the components of anelectronic device, causing damage to the device.

The damage caused by the electrostatic discharge event may render thedevice unusable. Therefore, there is a need in the art to reduce thepossibility of an electrostatic event failure for an electronic device.

SUMMARY

The present disclosure provides an electronic apparatus with increasedreliability.

Embodiments of the inventive concept provide an electronic apparatusincluding a base substrate comprising a first area in which a hole isdefined, a second area surrounding the first area, and a third areasurrounding the second area; a first sensing electrode disposed in thesecond area and comprising first sensing patterns and first connectionpatterns arranged in a first direction; and a second sensing electrodedisposed in the second area, spaced apart from the first sensingelectrode in a second direction crossing the first direction, andcomprising second sensing patterns and second connection patternsarranged in the first direction, wherein at least one first connectionpattern among the first connection patterns and at least one secondconnection pattern among the second connection patterns are spaced apartfrom each other in the second direction with the hole definedtherebetween, and a first distance in the second direction between theat least one first connection pattern and the at least one secondconnection pattern is greater than a second distance in the seconddirection between another first connection pattern among the firstconnection patterns and another second connection pattern among thesecond connection patterns.

The electronic apparatus further includes a third sensing electrodedisposed in the second area and including third sensing patterns andthird connection patterns, which are arranged in the second direction,and a fourth sensing electrode disposed in the second area and spacedapart from the third sensing electrode in the first direction, andincluding fourth sensing patterns and fourth connection patterns, whichare arranged in the second direction. Two third connection patternsamong the third connection patterns are spaced apart from each othersuch that the hole is defined therebetween, and a third distance betweenthe two third connection patterns is greater than a fourth distancebetween the other two third connection patterns adjacent to each otheramong the third connection patterns.

A fifth distance between one third connection pattern of the two thirdconnection patterns and one third connection pattern of the other twothird connection patterns adjacent to each other is smaller than thefourth distance. A third sensing pattern among the third sensingpatterns connected to one third connection pattern of the two thirdconnection patterns and one third connection pattern of the other twothird connection patterns has a size smaller than a size of a thirdsensing pattern among the third sensing patterns connected to the othertwo third connection patterns.

The third sensing electrode further includes a first connectionelectrode surrounding the hole entirely (e.g., on each side of the holein a plane). Two third sensing patterns among the third sensing patternsmay be spaced apart from each other such that the hole is definedtherebetween. And the two third sensing patterns may be electricallyconnected to each other by the first connection electrode.

The fourth sensing electrode further includes a second connectionelectrode surrounding a portion of the hole and spaced apart from thehole such that the first connection electrode is disposed therebetween.Two fourth sensing patterns among the fourth sensing patterns may bespaced apart from each other such that the hole is defined therebetween.And the two fourth sensing patterns are electrically connected to eachother by the second connection electrode.

The second connection electrode has a length shorter than a length ofthe first connection electrode. The first connection electrode includesa same material as the third sensing patterns and is disposed on a samelayer as the third sensing patterns, and the second connection electrodeincludes a same material as the fourth sensing patterns and is disposedon a same layer as the fourth sensing patterns.

The electronic apparatus further includes a first dummy electrodedisposed between the first connection electrode and the first sensingpatterns, and a second dummy electrode disposed between the secondconnection electrode and the first sensing patterns.

The first dummy electrode has a width equal to or greater than a widthof the first connection electrode, and the second dummy electrode has awidth equal to or greater than a width of the second connectionelectrode.

The electronic apparatus further includes a bypass pattern connected toone third sensing pattern among the third sensing patterns. Each of thethird connection patterns includes an island pattern, a first bridgepattern connected to the island pattern and one third sensing pattern ofthe third sensing patterns, and a second bridge pattern connected to theisland pattern and another third sensing pattern of the third sensingpatterns, and the bypass pattern has a length shorter than a length ofthe first bridge pattern.

The first connection patterns are disposed on a same layer as the firstsensing patterns and include a same material as the first sensingpatterns, and the second connection patterns are disposed on a samelayer as the second sensing patterns and includes a same material as thesecond sensing patterns. A width in the first direction of the hole isgreater than a width in the second direction of the hole.

Embodiments of the inventive concept provide an electronic apparatusincluding a display panel; and an input sensor disposed on the displaypanel, comprising unit sensor areas arranged in a first direction and asecond direction, and comprising sensing patterns and connectionpatterns electrically connecting the sensing patterns, wherein a hole isdefined through the display panel and the input sensor, wherein the unitsensor areas comprise a first unit sensor area overlapping the hole anda second unit sensor area not overlapping the hole, wherein a firstconnection pattern disposed in the first unit sensor area among theconnection patterns does not overlap the hole and is disposed in an areaof the first unit sensor area spaced apart from a first center of thefirst unit sensor area, and wherein a second connection pattern disposedin the second unit sensor area among the connection patterns is disposedat a second center of the second unit sensor area. A width in the firstdirection of the hole is greater than a width in the second direction ofthe hole.

The electronic apparatus further includes a first connection electrodesurrounding the hole entirely. The sensing patterns include a firstsensing pattern and a second sensing pattern spaced apart from the firstsensing pattern in the second direction such that the hole is disposedbetween the first and second sensing patterns, and the first sensingpattern and the second sensing pattern are electrically connected toeach other by the first connection electrode.

The electronic apparatus further includes a second connection electrodesurrounding a portion of the hole and spaced apart from the hole suchthat the first connection electrode is disposed between the hole and thesecond connection electrode. The sensing patterns further include athird sensing pattern and a fourth sensing pattern spaced apart from thethird sensing pattern in the second direction such that the hole isdisposed between the third sensing pattern and the fourth sensingpattern, and the third sensing pattern and the fourth sensing patternare electrically connected to each other by the second connectionelectrode.

The electronic apparatus further includes a first dummy electrodedisposed adjacent to the first connection electrode and a second dummyelectrode disposed adjacent to the second connection electrode. Thefirst dummy electrode has a width equal to or greater than a width ofthe first connection electrode, and the second dummy electrode has awidth equal to or greater than a width of the second connectionelectrode.

The unit sensor areas further include a third unit sensor areaoverlapping the hole, the first center of the first unit sensor areaoverlaps the hole, a third center of the third unit sensor area does notoverlap the hole, and a connection pattern disposed in the third unitsensor area among the connection patterns is disposed at the thirdcenter of the third unit sensor area.

The electronic apparatus further includes a bypass pattern connected toone second sensing pattern of two second sensing patterns arranged inthe second direction among the sensing patterns. Each of the connectionpatterns includes a connection pattern connecting two first sensingpatterns arranged in the first direction, an island pattern disposedbetween the two second sensing patterns and spaced apart from theconnection pattern, a first bridge pattern connected to the islandpattern and one of the two second sensing patterns, and a second bridgepattern connected to the island pattern and another of the two secondsensing patterns. The bypass pattern has a length shorter than a lengthof the first bridge pattern.

Embodiments of the inventive concept provide an electronic apparatuscomprising: a base substrate comprising a first area and a second area,wherein the first area comprises a hole through the substrate; aplurality of sensing electrodes arranged on the base substrate, whereineach of the plurality of sensing electrodes comprises one or moresensing patterns and one or more connection patterns, wherein a firstsubset of the connection patterns located within the first area arearranged according to a first grid pattern based on a first separationdistance in a first direction and a second separation distance in asecond direction, and a second subset of the connection patterns locatedwithin the second area are arranged according to a second grid patternbased on the first separation distance in the first direction and athird separation distance in the second direction, the second separationdistance being greater than the third separation distance. In someexamples, at least one pair of connection patterns in the first subsetare aligned in the first direction, and on two opposite sides of thehole in the second direction, and no pair of connection patterns in thesecond subset is separated by the hole in the second direction.

According to the above, the connection patterns of the input sensor maybe designed such that positions of the connection patterns do notoverlap the hole. Therefore, the number of additional lines used toconnect the sensing patterns is smaller than that when the connectionpatterns are omitted to correspond to the shape of the hole. Therefore,a size of peripheral area of the hole may be prevented from increasing.Additionally, the bypass patterns may be designed such that positions ofthe bypass patterns do not overlap the hole. As a result, a staticelectricity defect may be prevented by the bypass patterns.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other advantages of the present disclosure will becomereadily apparent by reference to the following detailed description whenconsidered in conjunction with the accompanying drawings wherein:

FIG. 1 is a perspective view showing an electronic apparatus accordingto an exemplary embodiment of the present disclosure;

FIG. 2 is an exploded perspective view showing an electronic apparatusaccording to an exemplary embodiment of the present disclosure;

FIG. 3 is a plan view showing a display panel according to an exemplaryembodiment of the present disclosure;

FIG. 4 is an enlarged view showing a portion AA′ of FIG. 3 ;

FIG. 5 is a plan view showing an input sensor according to an exemplaryembodiment of the present disclosure;

FIG. 6 is an enlarged plan view showing a portion BB′ shown in FIG. 5 ;

FIG. 7 is an enlarged plan view showing a portion CC′ of FIG. 6 ;

FIG. 8 is an enlarged plan view showing a portion DD′ of FIG. 6 ;

FIG. 9 is a cross-sectional view showing a display module according toan exemplary embodiment of the present disclosure;

FIG. 10 is a cross-sectional view showing a display module according toan exemplary embodiment of the present disclosure; and

FIG. 11 is a cross-sectional view showing a display module according toan exemplary embodiment of the present disclosure.

DETAILED DESCRIPTION

The present disclosure relates to an electronic device. Certainembodiments relate to systems and method for reducing the susceptibilityof an electronic device to damage from electrostatic discharge.Embodiments of the present disclosure include a device that includevarious electronic components, such as an input sensor that senses anexternal input and an electronic module. The electronic components maybe electrically connected to each other using signal lines. The inputsensor includes sensing electrodes used to sense the external input. Theelectronic module may include a camera, an infrared sensor, or aproximity sensor. The electronic module is disposed under the inputsensor. In some cases, the input sensor is provided with a hole toexpose the electronic module.

The position of the connection patterns of the input sensor may bedesigned to not overlap with the hole. Therefore, the position of theconnection patterns in the region adjacent to the hole may have anirregular arrangement.

Accordingly, the number of additional wires required to connect thesensing patterns may be less than when the connection patterns areomitted corresponding to the shape of the hole when the positions of theconnection patterns are adjusted. As a result, it is possible to limitthe size of the peripheral area of the hole. The position of the bypasspatterns can also be designed to not overlap the hole. Therefore, staticelectricity failure may be prevented.

In the present disclosure, it will be understood that when an element orlayer is referred to as being “on”, “connected to” or “coupled to”another element or layer, the element or layer can be directly on,connected or coupled to the other element or layer or interveningelements or layers may be present.

Like numerals refer to like elements throughout. In the drawings, thethickness, ratio, and dimension of components are exaggerated foreffective description of the technical content. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, components, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, component, region, layer or section fromanother region, layer, or section. Therefore, a first element,component, region, layer, or section discussed below could be termed asecond element, component, region, layer or section without departingfrom the teachings of the present disclosure. As used herein, thesingular forms, “a”, “an” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise.

Spatially relative terms, such as “beneath”, “below”, “lower”, “above”,“upper” and the like, may be used herein for ease of description todescribe one element or feature's relationship to another element(s) orfeature(s) as shown in the figures.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure belongs. It willbe further understood that terms, such as those defined in commonly useddictionaries, should be interpreted as with a meaning consistent withtheir meaning in the context of the relevant art and will not beinterpreted in an idealized or overly formal sense unless expressly sodefined herein.

It will be further understood that the terms “includes” and/or“including”, when used in this specification, specify the presence ofstated features, integers, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, integers, steps, operations, elements, components,and/or groups thereof.

Hereinafter, the present disclosure will be explained in detail withreference to the accompanying drawings.

FIG. 1 is a perspective view showing an electronic apparatus 1000according to an exemplary embodiment of the present disclosure. FIG. 2is an exploded perspective view showing the electronic apparatus 1000according to an exemplary embodiment of the present disclosure.

Referring to FIGS. 1 and 2 , the electronic apparatus 1000 may be anapparatus activated in response to an electrical signal. The electronicapparatus 1000 may be applied to a large-sized electronic item, such asa television set and a monitor, and a small and medium-sized electronicitem, such as a mobile phone, a tablet computer, a car navigation unit,a game unit, and a smartwatch. In the present exemplary embodiment, asmartphone will be described as a representative example of theelectronic apparatus 1000.

The electronic apparatus 1000 displays an image 1120 through a displaysurface 1110. The display surface 1110 is substantially parallel to eachof a first direction DR1 and a second direction DR2, toward a thirddirection DR3. The display surface 1110, through which the image 1120 isdisplayed, corresponds to a front surface 1110 of the electronicapparatus 1000 and a front surface 1110 of a window 1100. Hereinafter,the display surface and the front surface of the electronic apparatus1000 and the front surface of the window 1100 are assigned with the samereference numerals as each other.

In the present exemplary embodiment, front (or upper) and rear (orlower) surfaces of each member are defined with respect to a directionin which the image 1120 is displayed. The front and rear surfaces faceeach other in the third direction DR3, and a normal line direction ofeach of the front and rear surfaces is substantially parallel to thethird direction DR3.

The electronic apparatus 1000 includes the window 1100, a display module1200, electronic modules 1300, and a housing 1400. In the presentexemplary embodiment, the window 1100 and the housing 1400 are coupledto each other to provide an appearance of the electronic apparatus 1000.

The window 1100 includes an optically transparent insulating material.For example, the window 1100 includes a glass or plastic material. Thewindow 1100 has a single-layer or multi-layer structure. As an example,the window 1100 includes a plurality of plastic films attached to eachother by an adhesive or a glass substrate and a plastic film attached tothe glass substrate by an adhesive.

The window 1100 is divided into a transmissive area 1111 and a bezelarea 1112 in a plan view. In the following descriptions, the expression“in a plan view” may mean a state of being viewed in the third directionDR3. Additionally or alternatively, the expression “thickness direction”may mean the third direction DR3.

The transmissive area 1111 is optically transparent. For example, thebezel area 1112 has a relatively lower transmittance compared to thetransmissive area 1111. The bezel area 1112 defines a shape of thetransmissive area 1111. The bezel area 1112 is disposed adjacent to thetransmissive area 1111 and surrounds the transmissive area 1111.

The bezel area 1112 has a predetermined color. The bezel area 1112covers a peripheral area 1212 of the display module 1200 to prevent theperipheral area 1212 from being viewed from the outside. However, thisis merely exemplary, and the bezel area 1112 may be omitted from thewindow 1100 according to the exemplary embodiment of the presentdisclosure.

In the exemplary embodiment of the present disclosure, a sensor area1130 overlaps the electronic modules 1300 described later. According tothe present disclosure, the sensor area 1130 is defined to overlap thetransmissive area 1111. Accordingly, a separate area provided to definethe sensor area 1130 in the separate area rather than the transmissivearea 1111. Therefore, a size of the bezel area 1112 is reduced.

FIG. 2 shows one sensor area 1130 as a representative example. However,the present disclosure should not be limited thereto or thereby. Forexample, the sensor area 1130 is defined in two or more. Additionally oralternatively, FIG. 2 shows the sensor area 1130 defined at an upperleft side of the transmissive area 1111 as a representative example.However, the sensor area 1130 may be defined at an upper right side ofthe transmissive area 1111, at an upper center of the transmissive area1111, at a lower left side of the transmissive area 1111, or at a lowerright side of the transmissive area 1111.

The display module 1200 is disposed under the window 1100. In thepresent disclosure, the term “below” may mean a direction opposite to adirection in which the display module 1200 displays the image 1120. Thedisplay module 1200 displays the image 1120 and senses the externalinput. The display module 1200 includes a front surface 1210 in which anactive area 1211 and the peripheral area 1212 are defined. The activearea 1211 is activated in response to an electrical signal.

In the present exemplary embodiment, the active area 1211 is an areathrough which the image 1120 is displayed and the external input 2000 issensed. The transmissive area 1111 overlaps at least the active area1211. For example, the transmissive area 1111 overlaps an entire surfaceor at least a portion of the active area 1211. Accordingly, a userperceives the image 1120 or provides the external input 2000 through thetransmissive area 1111.

The peripheral area 1212 is covered by the bezel area 1112. Theperipheral area 1212 is disposed adjacent to the active area 1211. Theperipheral area 1212 surrounds the active area 1211. A driving circuitor a driving line is disposed in the peripheral area 1212 to drive theactive area 1211.

The display module 1200 includes a display panel 100, an input sensor200, and a driving circuit 300.

The display panel 100 includes configurations appropriate to generatethe image 1120. The image 1120 generated by the display panel 100 isdisplayed through the display surface 1210 and perceived by the userthrough the transmissive area 1111.

The input sensor 200 senses the external input 2000 applied from theoutside. For example, the input sensor 200 senses the external input2000 applied to the window 1100. The external input 2000 is a user'sinput. The user's input may include a variety of external inputs, suchas a part of user's body, light, heat, pen, or pressure. In the presentexemplary embodiment, the external input 2000 is shown by a user's handtouching the front surface 1110. However, this is merely exemplary. Asdescribed above, the external input 2000 may be provided in variousforms. Additionally or alternatively, the external input 2000 applied toa side surface or a rear surface of the electronic apparatus 1000depending on the structure of the electronic apparatus 1000 may besensed. However, the external input 2000 should not be particularlylimited.

The driving circuit 300 is electrically connected to the display panel100 and the input sensor 200. The driving circuit 300 includes a firstflexible film 310, a second flexible film 320, and a main circuit board330.

The first flexible film 310 is electrically connected to the displaypanel 100. The first flexible film 310 connects the display panel 100and the main circuit board 330. The first flexible film 310 is connectedto pads (display pads) of the display panel 100. The pads are disposedin the peripheral area 1212. The first flexible film 310 provideselectrical signals to the display panel 100 to drive the display panel100. The electrical signals are generated by the first flexible film 310or the main circuit board 330.

The second flexible film 320 is electrically connected to the inputsensor 200. The second flexible film 320 connects the input sensor 200and the main circuit board 330. The second flexible film 320 isconnected to pads (sensing pads) of the input sensor 200, which aredisposed in the peripheral area 1212. The second flexible film 320provides electrical signals to the input sensor 200 to drive the inputsensor 200. The electrical signals are generated by the second flexiblefilm 320 or the main circuit board 330.

The main circuit board 330 includes various driving circuits to drivethe display panel 100 and the input sensor 200 or a connector to providepower. The first and second flexible films 310 and 320 are connected tothe main circuit board 330. According to the present disclosure, thedisplay panel 100 and the input sensor 200 are controlled by using onemain circuit board 330. However, this is merely exemplary. In thedisplay module 1200, according to an exemplary embodiment of the presentdisclosure, the display panel 100 and the input sensor 200 may beconnected to different main circuit boards. One of the first and secondflexible films 310 and 320 may not be connected to the main circuitboard 330. However, the display panel 100 and the input sensor 200should not be limited to a particular embodiment.

In the exemplary embodiment of the present disclosure, a predeterminedhole 1220 (hereinafter, referred to as a “hole”) is defined in an areaof the display module 1200, which corresponds to the sensor area 1130.The hole 1220 is defined in the active area 1211 and penetrates throughthe display module 1200. Some areas of the display panel 100 and theinput sensor 200 are penetrated by the hole 1220. For example, the hole1220 is defined by removing all or at least a portion of components,wherein the components are disposed to overlap the sensor area 1130, ofthe display panel 100 and the input sensor 200. As the hole 1220 isdefined in the active area 1211, a size of the peripheral area 1212 isreduced.

When viewed in a plan view, the electronic modules 1300 overlaps thehole 1220 and the sensor area 1130. The electronic modules 1300 isdisposed under the display module 1200, and at least a portion of eachof the electronic modules 1300 is accommodated in the hole 1220. Theelectronic modules 1300 receive the external input applied theretothrough the sensor area 1130 or provide outputs through the sensor area1130.

In the exemplary embodiment of the present disclosure, three electronicmodules 1300 are shown. However, the number of the electronic modules1300 should not be limited to three. The electronic modules 1300 may bea camera module. However, the electronic modules 1300 should not belimited thereto or thereby. The electronic modules 1300 may include alight-emitting module, a light-receiving module, or a thermal-sensingmodule.

The housing 1400 is coupled to the window 1100. The housing 1400 iscoupled to the window 1100 to provide an inner space. The display module1200 and the electronic modules 1300 are accommodated in the innerspace.

The housing 1400 has a material with relatively high rigidity. Forexample, the housing 1400 includes glass, plastic, or metal material ora plurality of frames and/or plates of combinations thereof. The housing1400 stably protects the components of the electronic apparatus 1000accommodated in the inner space from external impacts.

FIG. 3 is a plan view showing the display panel 100 according to anexemplary embodiment of the present disclosure. FIG. 4 is an enlargedview showing a portion AA′ of FIG. 3 .

Referring to FIGS. 3 and 4 , the display panel 100 includes a basesubstrate 100-1, a plurality of pixels 110, a plurality of signal lines120, 130, and 140, a power pattern 150, and a plurality of display pads160.

The base substrate 100-1 includes an insulating substrate. For example,the base substrate 100-1 includes a glass substrate, a plasticsubstrate, or a combination thereof.

The base substrate 100-1 may be referred to as a “display basesubstrate”.

The base substrate 100-1 includes a first area 101, a second area 102,and a third area 103, which are defined therein. A hole 101-H is definedin the first area 101, and the first area 101 surrounds the hole 101-H.The second area 102 surrounds the first area 101. The third area 103surrounds the second area 102. The first area 101 overlaps the sensorarea 1130 (refer to FIG. 1 ). The second area 102 is included in theactive area 1211 (refer to FIG. 2 ). The third area 103 is included inthe peripheral area 1212 (refer to FIG. 2 ).

The signal lines 120, 130, and 140 are electrically connected to thepixels 110 to transmit the electrical signals to the pixels 110. In FIG.3 , the signal lines 120, 130, and 140 including a data line 120, a scanline 130, and a power line 140 are shown as a representative example.However, these are merely exemplary. The signal lines 120, 130, and 140may further include one of an initialization voltage line and alight-emitting control line and should not be limited to a particularembodiment.

The pixels 110 are disposed on the second area 102. In the presentexemplary embodiment, an equivalent circuit diagram of one pixel 110 isshown as a representative example. The pixel 110 includes a first thinfilm transistor 111, a second thin film transistor 112, a capacitor 113,and a light-emitting device 114. The first thin film transistor 111 is aswitching device that controls an on-off of the pixel 110. The firstthin film transistor 111 transmits or blocks a data signal appliedthereto through the data line 120 in response to a scan signal appliedthereto through the scan line 130.

The capacitor 113 is connected to the power line 140 and the first thinfilm transistor 111. The capacitor 113 is charged with an electriccharge by an amount corresponding to a difference between the datasignal transmitted from the first thin film transistor 111 and a firstpower signal applied to the power line 140.

The second thin film transistor 112 is connected to the first thin filmtransistor 111, the capacitor 113, and the light-emitting device 114.The second thin film transistor 112 controls a driving current flowingthrough the light-emitting device 114 in response to the amount of theelectric charge charged in the capacitor 113. A turn-on time of thesecond thin film transistor 112 is determined in accordance with theamount of the electric charge charged in the capacitor 113. The secondthin film transistor 112 provides the first power signal applied theretothrough the power line 140 to the light-emitting device 114.

The light-emitting device 114 generates light or controls an amount ofthe light in response to electrical signals. For example, thelight-emitting device 114 includes an organic light-emitting device or aquantum dot light-emitting device.

The light-emitting device 114 is connected to a power terminal 115 andreceives a power signal (hereinafter, referred to as a “second powersignal”) different from the first power signal provided through thepower line 140. The driving current corresponding to a differencebetween an electrical signal provided from the second thin filmtransistor 112 and the second power signal flows through thelight-emitting device 114, and the light-emitting device 114 generatesthe light corresponding to the driving current. Meanwhile, this ismerely exemplary, and the pixel 110 may include electronic elements withvarious configurations and arrangements. However, the pixel 110 shouldnot be particularly limited.

As described above, the hole 101-H is surrounded by the active area 1211(refer to FIG. 2 ). Accordingly, at least some of the pixels 110 arearranged adjacent to the hole 101-H.

Some pixels 110 of the pixels 110 surround the hole 101-H.

A plurality of signal lines 121 and 131 electrically connected to thepixels 110 is disposed in the first area 101. The signal lines 121 and131 are connected to the pixels 110 via the first area 101. For theconvenience of explanation, FIG. 4 shows a first signal line 121 and asecond signal line 131 among the signal lines connected to the pixels110 as a representative example.

The first signal line 121 extends in the second direction DR2. The firstsignal line 121 is connected to the pixels 110 arranged in the samecolumn in the second direction DR2 among the pixels 110. The firstsignal line 121 is described as corresponding to the data line 120.

Some or all of the pixels 110 connected to the first signal line 121 aredisposed at an upper side with respect to the hole 101-H. The others ofthe pixels 110 are disposed at a lower side with respect to the hole101-H. Accordingly, the pixels 110 arranged in the same column andconnected to the first signal line 121 receive the data signal throughthe same line even though some pixels 110 are removed by forming thehole 101-H.

The second signal line 131 extends in the first direction DR1. Thesecond signal line 131 is connected to the pixels 110 arranged in thesame row in the first direction DR1 among the pixels 110. The secondsignal line 131 is described as corresponding to the scan line 130.

Some pixels of the pixels 110 connected to the second signal line 131are disposed at a left side with respect to the hole 101-H, and theothers are disposed at a right side with respect to the hole 101-H.Accordingly, the pixels 110 arranged in the same row and connected tothe second signal line 131 are turned on and off by substantially thesame gate signal even though some pixels 110 are removed by forming thehole 101-H.

Referring to FIG. 3 again, the power pattern 150 is disposed in thethird area 103. The power pattern 150 is electrically connected to thepower lines 140. The display panel 100 includes the power pattern 150.Therefore, the display panel 100 provides the first power signal withsubstantially the same level to the pixels 110.

The display pads 160 include a first pad 161 and a second pad 162. Thefirst pad 161 is provided in plural, and the first pads 161 arerespectively connected to the data lines 120. The second pad 162 isconnected to the power pattern 150 and electrically connected to thepower line 140.

The display panel 100 provides electrical signals applied theretothrough the display pads 160 from the outside to the pixels 110.Meanwhile, the display pads 160 further include pads to receive otherelectrical signals in addition to the first pad 161 and the second pad162. However, the display pads 160 should not be particularly limited.

FIG. 5 is a plan view showing an input sensor 200 according to anexemplary embodiment of the present disclosure. FIG. 6 is an enlargedplan view showing a portion BB′ shown in FIG. 5 .

Referring to FIGS. 5 and 6 , the input sensor 200 includes a basesubstrate 100-4, receiving electrodes 210 and 220, transmittingelectrodes 230 and 240, first sensing lines 250, second sensing lines261 and 262, ground lines 271 and 272, and sensing pads 280.

The base substrate 100-4 includes an insulating substrate. For example,the base substrate 100-4 includes a glass substrate, a plasticsubstrate, or a combination thereof.

The base substrate 100-4 includes a first area 201, a second area 202,and a third area 203, which are defined therein. A hole 201-H is definedin the first area 201, and the first area 201 surrounds the hole 201-H.The second area 202 surrounds the first area 201. The third area 203surrounds the second area 202. At least a portion of the first area 201overlaps the sensor area 1130 (refer to FIG. 1 ). The second area 202 isincluded in the active area 1211 (refer to FIG. 2 ). The third area 203is included in the peripheral area 1212 (refer to FIG. 2 ).

The hole 201-H overlaps the hole 101-H, and the holes 101-H and 201-Hform the hole 1220 (refer to FIG. 2 ). A first width 201-WT1 in thefirst direction DR1 of the hole 201-H is greater than a second width201-WT2 in the second direction DR2 of the hole 201-H. Each of the firstwidth 201-WT1 and the second width 201-WT2 is a maximum width in acorresponding direction thereof. The hole 201-H may be referred to as a“wide hole”.

The receiving electrodes 210 and 220 and the transmitting electrodes 230and 240 are disposed in the second area 202. The input sensor 200obtains information about the external input 2000 (refer to FIG. 1 )based on a variation in capacitance between the receiving electrodes 210and 220 and the transmitting electrodes 230 and 240.

The receiving electrodes 210 and 220 extend in the first direction DR1and are arranged in the second direction DR2. The transmittingelectrodes 230 and 240 extend in the second direction DR2 and arearranged in the first direction DR1.

A transmission signal is applied to the transmitting electrodes 230 and240. The variation in capacitance between the receiving electrodes 210and 220, and the transmitting electrodes 230 and 240 is sensed throughthe receiving electrodes 210 and 220. In the exemplary embodiment of thepresent disclosure, the transmitting electrodes 230 and 240 may bechanged to the receiving electrodes 210 and 220, and vice versa.

The receiving electrodes 210 and 220 include a first sensing electrode210 and a second sensing electrode 220. The transmitting electrodes 230and 240 include a third sensing electrode 230 and a fourth sensingelectrode 240.

The first sensing electrode 210 includes first sensing patterns 211 andfirst connection patterns 212. The first sensing patterns 211 and thefirst connection patterns 212 are arranged in the first direction DR1.

The second sensing electrode 220 is spaced apart from the first sensingelectrode 210 in the second direction DR2. The second sensing electrode220 includes second sensing patterns 221 and second connection patterns222. The second sensing patterns 221 and the second connection patterns222 are arranged in the first direction DR1.

The third sensing electrode 230 includes third sensing patterns 231 andthird connection patterns 232. The third sensing patterns 231 and thethird connection patterns 232 are arranged in the second direction DR2.

The fourth sensing electrode 240 is spaced apart from the third sensingelectrode 230 in the first direction DR1. The fourth sensing electrode240 includes fourth sensing patterns 241 and fourth connection patterns242. The fourth sensing patterns 241 and the fourth connection patterns242 are arranged in the second direction DR2.

The first sensing electrode 210 and the second sensing electrode 220 aredisposed adjacent to the hole 201-H. A portion of the first sensingelectrode 210 and a portion of the second sensing electrode 220 arespaced apart from each other with the hole 201-H defined therebetween.

At least one first connection pattern 212-1 of the first connectionpatterns 212 and at least one second connection pattern 222-1 of thesecond connection patterns 222 are spaced apart from each other with thehole 201-H defined therebetween. A first distance 21-L1 between thefirst connection pattern 212-1 and the second connection pattern 222-1is greater than the second width 201-WT2 of the hole 201-H.

A second distance 21-L2 between the other first connection pattern 212-2of the first connection patterns 212 and the other second connectionpattern 222-2 of the second connection patterns 222 is smaller than thefirst distance 21-L1. The hole 201-H may not be defined between thefirst connection pattern 212-2 and the second connection pattern 222-2.

An imaginary line that penetrates through the first connection pattern212-1 and extends in the first direction DR1 does not overlap the firstconnection pattern 212-2. Additionally or alternatively, an imaginaryline that penetrates through the second connection pattern 222-1 andextends in the first direction DR1 does not overlap the secondconnection pattern 222-2. The imaginary lines may be straight lines.

At least two third connection patterns 232-1 and 232-2 among the thirdconnection patterns 232 are spaced apart from each other with the hole201-H defined therebetween. The hole 201-H may not be defined betweenother two third connection patterns 232-3 and 232-4 adjacent to eachother among the third connection patterns 232.

A third distance 21-L3 between the two third connection patterns 232-1and 232-2 is greater than a fourth distance 21-L4 between the other twothird connection patterns 232-3 and 232-4 adjacent to each other.

A fifth distance 21-L5 between one third connection pattern 232-2 of thetwo third connection patterns 232-1 and 232-2 and one third connectionpattern 232-3 of the other two third connection patterns 232-3 and 232-4adjacent to each other is smaller than the fourth distance 21-L4.

Among the third sensing patterns 231, a size of the third sensingpattern 231-1 connected to the one third connection pattern 232-2 of thetwo third connection patterns 232-1 and 232-2 and the one thirdconnection pattern 232-3 of the other two third connection patterns232-3 and 232-4 adjacent to each other is smaller than a size of thethird sensing pattern 231-2 connected to the other two third connectionpatterns 232-3 and 232-4 adjacent to each other among the third sensingpatterns 231.

According to the exemplary embodiment of the present disclosure,positions of some connection patterns among the connection patterns maybe adjusted corresponding to the shape and position of the hole 201-H.For example, when assuming that the connection patterns and the sensingpatterns are regularly arranged, overlapping connection patterns thatoverlap the hole 201-H are defined. According to the exemplaryembodiment, positions of the overlapping connection patterns may bechanged and designed so that the overlapping connection patterns do notoverlap the hole 201-H. For example, the overlapping connection patternsmay be disposed in the second area 202. Therefore, the connectionpatterns and the sensing patterns may be irregularly arranged in someareas. For example, some connection patterns may be irregularly arrangedin an area adjacent to the hole 201-H.

According to the exemplary embodiment of the present disclosure, sincethe positions of the first connection patterns 212-1 and the secondconnection patterns 222-1 are adjusted, all the first connectionpatterns 212-1 and the first sensing patterns 211 are electricallyconnected, and all the second connection patterns 222-1 and the secondsensing patterns 221 are electrically connected. Additionally oralternatively, additional lines to electrically connect the firstsensing patterns 211 and to electrically connect the second sensingpatterns 221 are not required. Therefore, an increase in the size of thefirst area 201 may be prevented. The first area 201 corresponds to theperipheral area of the hole 201-H but is not the active area.

Unit sensor areas 204, 205, and 206 are defined in the input sensor 200and arranged in the first direction DR1 and the second direction DR2.Portions of each of the four sensing patterns and two connectionpatterns are disposed in each of the unit sensor areas 204, 205, and206. The four sensing patterns and two connection patterns may beinsulated from each other while crossing each other.

The unit sensor areas 204, 205, and 206 include a first unit sensor area204, a second unit sensor area 205, and a third unit sensor area 206.Each of the first, second, and third unit sensor areas 204, 205, and 206may have a quadrangular shape. Additionally or alternatively, first,second, and third centers 204 c, 205 c, and 206 c are respectivelydefined in the first, second, and third unit sensor areas 204, 205, and206.

Some areas of the first unit sensor area 204 overlap the hole 201-H, andthe first center 204 c of the first unit sensor area 204 overlaps thehole 201-H. The second unit sensor area 205 and the second center 205 cof the second unit sensor area 205 do not overlap the hole 201-H. Someareas of the third unit sensor area 206 overlap the hole 201-H, and thethird center 206 c of the third unit sensor area 206 does not overlapthe hole 201-H.

Connection patterns 222-4 disposed in the first unit sensor area 204 donot overlap the first center 204 c. The connection patterns 222-4 arespaced apart from the first center 204 c. Connection patterns 222-5disposed in the second unit sensor area 205 overlap the second center205 c, and connection patterns 222-6 disposed in the third unit sensorarea 206 overlap the third center 206 c.

When the connection patterns are all arranged regularly at the centersof the unit sensor areas, the connection patterns disposed at the areasoverlapping the hole 201-H may be omitted. However, according to theexemplary embodiment of the present disclosure, when the center of theunit sensor area overlaps the hole 201-H, the connection pattern may bedesigned to be disposed in an area spaced from the center. Accordingly,the connection pattern may be retained in the area surrounding the hole201-H.

According to an exemplary embodiment of the present disclosure, thethird sensing electrode 230 further includes a first connectionelectrode 233. The first connection electrode 233 surrounds the hole201-H entirely. For example, the first connection electrode 233 form aclosed curve shape in a plane. The two third sensing patterns 231 arespaced apart from each other with the hole 201-H defined therebetween.The two third sensing patterns 231 are electrically connected to thefirst connection electrode 233.

According to an exemplary embodiment of the present disclosure, the twothird sensing patterns 231 have the same effect as being connectedthrough two lines. Therefore, although a portion of a left side of thefirst connection electrode 233 is unintentionally disconnected, the twothird sensing patterns 231 are electrically connected to each otherthrough a portion of a right side of the first connection electrode 233.

According to an exemplary embodiment of the present disclosure, thefourth sensing electrode 240 further includes a second connectionelectrode 243. The second connection electrode 243 surrounds a portionof the hole 201-H. The second connection electrode 243 is spaced apartfrom the hole 201-H such that the first connection electrode 233 isdisposed between the second connection electrode 243 and the hole 201-H.

According to an exemplary embodiment of the present disclosure, thethird sensing electrode 230 is disposed to be more adjacent to a centerarea of the hole 201-H than the fourth sensing electrode 240 is. Thefirst connection electrode 233 has a length longer than a length of thesecond connection electrode 243. Additionally or alternatively, thelength of the first connection electrode 233 is two times longer thanthe length of the second connection electrode 243. Since the length ofthe second connection electrode 243 is relatively shorter than thelength of the first connection electrode 233, the probability that thesecond connection electrode 243 is disconnected is lower than that ofthe first connection electrode 233.

The first sensing lines 250 and the second sensing lines 261 and 262 aredisposed in the third area 203. The first sensing lines 250 areelectrically connected to the receiving electrodes 210 and 220. Thesecond sensing lines 261 are electrically connected to one or more endsof the transmitting electrodes 230 and 240, respectively. The secondsensing lines 262 are electrically connected to the other ends of thetransmitting electrodes 230 and 240, respectively.

The transmitting electrodes 230 and 240 have a relatively longer lengththan the receiving electrodes 210 and 220. Accordingly, two secondsensing lines 261 and 262 are electrically connected to the transmittingelectrodes 230 and 240, respectively. Therefore, the sensitivity of thetransmitting electrodes 230 and 240 is uniformly maintained. However,this is merely exemplary. For example, some of the second sensing lines261 and 262, e.g., the second sensing lines 262, may be omitted.

Ground lines 271 and 272 are disposed in the third area 203. The groundlines 271 and 272 receive a ground voltage. For example, electriccharges are discharged through the ground lines 271 and 272. Therefore,a device destruction due to electrostatic discharge may be prevented.

The sensing pads 280 are disposed in the third area 203. The sensingpads 280 include first sensing pads 281, second sensing pads 282, thirdsensing pads 283, and fourth sensing pads 284. The first sensing pads281 are respectively connected to the first sensing lines 250. Thesecond sensing pads 282 are respectively connected to the second sensinglines 261. The third sensing pads 283 are respectively connected to thesecond sensing lines 262. The fourth sensing pads 284 are respectivelyconnected to the ground lines 271 and 272.

Accordingly, embodiments of the inventive concept provide an electronicapparatus comprising: a base substrate (e.g., base substrate 100-1)comprising a first area and a second area, wherein the first areacomprises a hole (e.g., the hole 101-H) through the base substrate; aplurality of sensing electrodes (e.g., first sensing electrode 210 andsecond sensing electrode 220) arranged on the base substrate, whereineach of the plurality of sensing electrodes comprises one or moresensing patterns (e.g., first sensing patterns 211 or second sensingpatterns 221) and one or more connection patterns (e.g., firstconnection pattern 212 or second connection pattern 222), wherein afirst subset of the connection patterns located within the first area isarranged according to a first grid pattern based on a first separationdistance in a first direction and a second separation distance in asecond direction (e.g., first distance 21-L1), and a second subset ofthe connection patterns located within the second area is arrangedaccording to a second grid pattern based on the first separationdistance in the first direction and a third separation distance in thesecond direction (e.g., second distance 21-L2), the second separationdistance being greater than the third separation distance. In someexamples, at least one pair of connection patterns in the first subsetare aligned in the first direction, and on two opposite sides of thehole in the second direction, and no pair of connection patterns in thesecond subset is separated by the hole in the second direction.

FIG. 7 is an enlarged plan view showing a portion CC′ of FIG. 6 . FIG. 8is an enlarged plan view showing a portion DD′ of FIG. 6 .

FIG. 7 shows the area in which the first connection pattern 212 and thethird connection pattern 232 are disposed and a peripheral area thereof.The first connection pattern 212 is disposed on the same layer as thefirst sensing patterns 211 and includes the same material as the firstsensing patterns 211. Additionally or alternatively, the firstconnection pattern 212 and the first sensing patterns 211 have anintegral shape. The first sensing patterns 211 may be referred to as“first portions”, and the first connection pattern 212 may be referredto and “second portion”.

The first connection pattern 212 and the first sensing patterns 211include a transparent conductive oxide. For example, the firstconnection pattern 212 and the first sensing patterns 211 include atleast one of indium tin oxide (ITO), indium zinc oxide (IZO), indiumgallium oxide (IGO), indium gallium zinc oxide (IGZO), andmixtures/compounds thereof. However, the first connection pattern 212and the first sensing patterns 211 should not be limited thereto orthereby.

The third connection pattern 232 includes an island pattern 232-11, afirst bridge pattern 232-22, and a second bridge pattern 232-33. Theisland pattern 232-11 is disposed between third sensing patterns 231 aand 231 b. The first bridge pattern 232-22 is connected to one thirdsensing pattern 231 a and the island pattern 232-11. The second bridgepattern 232-33 is connected to the other third sensing pattern 231 b andthe island pattern 232-11.

The input sensor 200 further includes a bypass pattern 232-44, and thebypass pattern 232-44 is connected to the third sensing pattern 231 a.The bypass pattern 232-44 is provided in plural, and the bypass patterns232-44 are connected to the third sensing patterns 231 a and 231 b. Thebypass patterns 232-44 include the same material as the first bridgepattern 232-22 and the second bridge pattern 232-33. Additionally oralternatively, the bypass patterns 232-44 are disposed on the same layeras the first bridge pattern 232-22 and the second bridge pattern 232-33.

The island pattern 232-11 is disposed on the same layer as the thirdsensing patterns 231 a and 231 b and includes the same material as thethird sensing patterns 231 a and 231 b. The island pattern 232-11 issurrounded by the first sensing patterns 211 and the first connectionpattern 212. The island pattern 231-11 includes a transparent conductiveoxide.

The first and second bridge patterns 232-22 and 232-33 are insulatedfrom the first connection pattern 212 while crossing the firstconnection pattern 212. Each of the first and second bridge patterns232-22 and 232-33 includes a metal material and has a single-layer ormulti-layer structure. For example, each of the first and second bridgepatterns 232-22 and 232-33 has the multi-layer structure in whichtitanium, aluminum, and titanium are sequentially stacked one onanother.

The bypass pattern 232-44 has a length shorter than a length of thefirst bridge pattern 232-22. The bypass pattern 232-44 has a resistancelower than a resistance of the first bridge pattern 232-22. Accordingly,when a static electricity occurs, the static electricity is concentratedat the bypass patterns 232-44 with the lower resistance. As a result,the first and second bridge patterns 232-22 and 232-33 may be preventedfrom being damaged due to the static electricity.

Different from the exemplary embodiment of the present disclosure, whenthe connection patterns are regularly arranged, the connection patternsand the bypass patterns may be omitted corresponding to the shape of thehole 201-H. As the bypass patterns are omitted, electrostatic failurerisk may increase. According to the exemplary embodiment of the presentdisclosure, the positions of the connection patterns and the bypasspatterns may be adjusted corresponding to the shape of the hole 201-H.As a result, the bypass patterns may be disposed in the peripheral areaof the hole 201-H without being omitted. Therefore, the electrostaticfailure risk may be prevented from increasing.

The first connection electrode 233 extends from the third sensingpattern 231 a. The first connection electrode 233 includes the samematerial as the third sensing pattern 231 a and is disposed on the samelayer as the third sensing pattern 231 a. The first connection electrode233 is provided integrally with the third sensing pattern 231 a.

The first dummy electrodes 291 are disposed between the first connectionelectrode 233 and the first sensing patterns 211. Each of the firstdummy electrodes 291 has a width 29-WT equal to or greater than a width23-WT of the first connection electrode 233. The first connectionelectrode 233 may be prevented from coupling to the first sensingpatterns 211 by the first dummy electrodes 291.

FIG. 8 shows the area in which the first connection pattern 212 and thefourth connection pattern 242 are disposed and a peripheral areathereof. The fourth connection pattern 242 electrically connects twofourth sensing patterns 241 a and 241 b adjacent to each other.

The fourth connection pattern 242 includes an island pattern 242-11, afirst bridge pattern 242-22, and a second bridge pattern 242-33. Theisland pattern 242-11 is disposed between the fourth sensing patterns241 a and 241 b. The first bridge pattern 242-22 is connected to onefourth sensing pattern 241 a and the island pattern 242-11. The secondbridge pattern 242-33 is connected to the other fourth sensing pattern241 b and the island pattern 242-11. A bypass pattern 242-44 has alength shorter than a length of the first bridge pattern 242-22.

The second connection electrode 243 extends from the fourth sensingpattern 241 a. The second connection electrode 243 includes the samematerial as the fourth sensing pattern 241 a and is disposed on the samelayer as the fourth sensing pattern 241 a. The second connectionelectrode 243 is provided integrally with the fourth sensing pattern 241a.

A second dummy electrode 292 is disposed between the second connectionelectrode 243 and the first sensing pattern 211. The second dummyelectrode 292 has a width 29-WT equal to or greater than a width 24-WTof the second connection electrode 243. The second connection electrode243 may be prevented from coupling to the first sensing patterns 211 bythe second dummy electrodes 292.

A third dummy electrode 293 and a fourth dummy electrode 294 aredisposed in an area in which the sensing patterns are not disposed. Forexample, the third and fourth dummy electrodes 293 and 294 are disposedbetween the first sensing patterns 211 and the third sensing patterns231 a and 231 b and between the first sensing patterns 211 and thefourth sensing patterns 241 a and 241 b. A difference in reflectancebetween the area in which the sensing patterns are disposed and the areain which the sensing patterns are not disposed is reduced by the thirdand fourth dummy electrodes 293 and 294. Accordingly, the sensingpatterns are not viewed. Therefore, optical viewing characteristics maybe increased.

FIG. 9 is a cross-sectional view showing a display module 1200 accordingto an exemplary embodiment of the present disclosure.

Referring to FIG. 9 , the display module 1200 includes the display panel100 and the input sensor 200.

The display panel 100 includes the base substrate 100-1, a circuit layer100-2, a display element layer 100-3, and a base substrate 100-4. Thecircuit layer 100-2 is disposed on the base substrate 100-1, the displayelement layer 100-3 is disposed on the circuit layer 100-2, and the basesubstrate 100-4 is disposed on the display element layer 100-3.

An auxiliary layer 10 is disposed on the base substrate 100-1 to cover afront surface of the base substrate 100-1. The auxiliary layer 10includes an inorganic material. The auxiliary layer 10 includes abarrier layer and/or a buffer layer. Accordingly, the auxiliary layer 10prevents oxygen or moisture introduced through the base substrate 100-1from entering the pixel 110 or reduces a surface energy of the basesubstrate 100-1 such that the pixel 110 is stably formed on the basesubstrate 100-1.

The pixel 110 is disposed on the second area 102. In the presentexemplary embodiment, the first thin film transistor 111 and thelight-emitting device 114 among the components of the equivalent circuitdiagram of the pixel 110 shown in FIG. 3 are shown as a representativeexample.

The first thin film transistor 111 includes an active A1, a source S1, adrain D1, and a gate G1. The active A1, the source S1, and the drain D1are provided by one semiconductor pattern.

For example, the semiconductor pattern is disposed on the auxiliarylayer 10. The semiconductor pattern includes polysilicon. However, thesemiconductor pattern may include amorphous silicon or metal oxideaccording to embodiments. The semiconductor pattern includes a dopedregion and a non-doped region. The doped region is doped with an N-typedopant or a P-type dopant. A P-type transistor includes a doped regiondoped with the P-type dopant. The doped region has a conductivitygreater than that of the non-doped region and substantially serves as anelectrode or signal line. The non-doped region substantially correspondsto the active (or channel). In other words, a portion of thesemiconductor pattern may be the active A1 of the first thin filmtransistor 111, another portion of the semiconductor pattern may be thesource S1 or the drain D1 of the first thin film transistor 111, and theother portion of the semiconductor pattern may be a connection electrodeor a connection signal line.

The first insulating layer 20 is disposed on the auxiliary layer 10 tocover the active A1, the source S1, and the drain D1. The firstinsulating layer 20 is an inorganic layer and/or an organic layer andhas a single-layer or multi-layer structure. The first insulating layer20 may include at least one of aluminum oxide, titanium oxide, siliconoxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In thepresent exemplary embodiment, the first insulating layer 20 has asingle-layer structure of a silicon oxide layer. An insulating layer ofthe circuit layer 100-2 described later is an inorganic layer and/or anorganic layer and has a single-layer or multi-layer structure as well asthe first insulating layer 20. The inorganic layer includes at least oneof the materials mentioned above.

The gate G1 is disposed on the first insulating layer 20. The gate G1corresponds to a portion of metal pattern. The gate G1 overlaps theactive A1. The gate G1 is used as a mask in the process of doping thesemiconductor pattern.

The second signal line 131 is disposed on the first insulating layer 20.Additionally or alternatively, the second signal line 131 is disposed onthe first area 101.

The second insulating layer 30 is disposed on the first insulating layer20 and covers the gate G1 and the second signal line 131. The secondinsulating layer 30 is an inorganic layer and/or an organic layer andhas a single-layer or multi-layer structure. In the present exemplaryembodiment, the second insulating layer 30 has a single-layer structureof silicon oxide.

The first signal line 121 is disposed on the second insulating layer 30.Additionally or alternatively, the first signal line 121 is disposed inthe first area 101.

The third insulating layer 40 is disposed on the second insulating layer30 and covers the first signal line 121.

The light-emitting device 114 is disposed on the third insulating layer40. The light-emitting device 114 includes a first electrode AE, alight-emitting layer EML, and a second electrode CE.

The first electrode AE is electrically connected to the first thin filmtransistor 111. For example, the first electrode AE is electricallyconnected to the first thin film transistor 111 via the second thin filmtransistor 112 (refer to FIG. 3 ).

The fourth insulating layer 50 is disposed on the third insulating layer40. The fourth insulating layer 50 includes an organic material and/oran inorganic material and has a single-layer or multi-layer structure.An opening is defined through the fourth insulating layer 50, and atleast a portion of the first electrode AE is exposed through theopening. The fourth insulating layer 50 may be referred to as a “pixeldefinition layer”.

The light-emitting layer EML is disposed on the first electrode AEexposed through the opening. The light-emitting layer EML includes alight-emitting material. The light-emitting layer EML may include atleast one material among materials respectively emitting red, green, andblue lights. The light-emitting layer EML includes a fluorescentmaterial or a phosphorescent material. The light-emitting layer EMLincludes an organic light-emitting material or an inorganiclight-emitting material. The light-emitting layer EML emits the light inresponse to a difference in electric potential between the firstelectrode AE and a second electrode CE.

The second electrode CE is disposed on the light-emitting layer EML. Thesecond electrode CE faces the first electrode AE. The second electrodeCE is commonly disposed in the pixels 110. Each of the pixels 110receives a common voltage (hereinafter, referred to as a “second powervoltage”) through the second electrode CE.

A recessed portion 170 is defined in the first area 101. The recessedportion 170 is provided to surround an edge of the hole 1220. Therecessed portion 170 blocks a path in which moisture or oxygenintroduced through the hole 1220 enters the pixel 110. The recessedportion 170 is defined by removing some portions of the componentsforming the display panel 100. For example, some portions of the second,third, and fourth insulating layers 30, 40, and 50 are removed toprovide the recessed portion 170. However, this is merely exemplary.According to an exemplary embodiment of the present disclosure, therecessed portion 170 may not be provided.

The base substrate 100-4 is disposed on the second electrode CE. Thebase substrate 100-4 is spaced apart from the second electrode CE. Aspace 60 between the base substrate 100-4 and the second electrode CE isfilled with air or inert gas. Additionally or alternatively, in theexemplary embodiment of the present disclosure, the space 60 may befilled with a filler, such as a silicon-based polymer, an epoxy-basedresin, or an acrylic-based resin.

The base substrate 100-4 is coupled to the base substrate 100-1 by asealing member 180. The sealing member 180 defines an inner surface ofthe hole 1220. The sealing member 180 includes an organic material, suchas a light-curable resin or a light plastic resin, or an inorganicmaterial such as a frit seal. However, the sealing member 180 should notbe limited to a particular embodiment.

The input sensor 200 includes the base substrate 100-4, a plurality ofconductive layers, and a plurality of insulating layers 201L1 and 201L2.In the exemplary embodiment of the present disclosure, the basesubstrate 100-4 is included in all the input sensor 200 and the displaypanel 100. For example, the base substrate 100-4 may be an encapsulationsubstrate of the display panel 100 and may be a base substrate on whichthe components of the input sensor 200 are formed. In the exemplaryembodiment of the present disclosure, the base substrate of the inputsensor 200 may be provided as a separate component from the basesubstrate 100-4 of the display panel 100. In this case, an adhesivelayer may be additionally disposed between the base substrate of theinput sensor 200 and the base substrate 100-4 of the display panel 100.

In the exemplary embodiment of the present disclosure, the conductivelayer of the input sensor 200 may be disposed on an encapsulation layerinstead of the base substrate 100-4. For example, the base substrate100-4 may be omitted, and the encapsulation layer may be disposed on thedisplay element layer 100-3 and may encapsulate the display elementlayer 100-3. The encapsulation layer may include an inorganic layer, anorganic layer, and an inorganic layer, which are sequentially stacked.The conductive layer of the input sensor 200 may be disposed directly onthe encapsulation layer to make contact with the encapsulation layer.Additionally or alternatively, according to another exemplaryembodiment, a planarization layer may be additionally disposed on theencapsulation layer to planarize the encapsulation layer. In this case,the conductive layer of the input sensor 200 may be disposed directly onthe planarization layer to make contact with the planarization layer.

In the exemplary embodiment of the present disclosure, the input sensor200 further includes a cover portion 201 c. For example, the coverportion 201 c is disposed in the first area 201. A laser etching processis used to form the hole 1220 through the display module 1200. The coverportion 201 c is disposed adjacent to the area in which the hole 1220 isformed to protect components disposed under the cover portion 201 c. Forexample, the cover portion 201 c prevents the first signal line 121 andthe second signal line 131 from being damaged by a laser beam.

In the exemplary embodiment of the present disclosure, the cover portion201 c is electrically connected to the ground line 271 (refer to FIG. 5) through at least one dummy electrode or at least one connection line.In this case, electric charges generated during the process aredischarged through the ground line 271 (refer to FIG. 5 ) without beingaccumulated on the cover portion 201 c. Accordingly, the destruction ofa peripheral element caused when the accumulated electric charges aredischarged, for example, the first sensing pattern 211, may beprevented.

The cover portion 201 c includes a first cover pattern 201-1, a secondcover pattern 201-2, a third cover pattern 201-3, and a fourth coverpattern 201-4. However, this is merely exemplary. The number of thecover patterns included in the cover portion 201 c may be changed.

The cover portion 201 c forms the first conductive layer. The firstconductive layer further includes the first and second bridge patterns232-22 and 232-33 (refer to FIG. 7 ), the first sensing lines 250 (referto FIG. 5 ), the second sensing lines 261 and 262 (refer to FIG. 5 ),the ground lines 271 and 272 (refer to FIG. 5 ).

The first conductive layer includes a metal material and has asingle-layer or multi-layer structure. For example, the first conductivelayer has the multi-layer structure in which titanium, aluminum, andtitanium are sequentially stacked one on another. However, this ismerely exemplary. The material for the first conductive layer should notbe limited thereto or thereby.

The first insulating layer 201L1 covers the first conductive layer. Thefirst insulating layer 201L1 includes an organic material and/or aninorganic material and has a single-layer or multi-layer structure. Inthe exemplary embodiment of the present disclosure, the first insulatinglayer 201L1 has the single-layer structure of silicon oxide.

The second conductive layer is disposed on the first insulating layer201L1. The second conductive layer includes first, second, third, andfourth sensing patterns 211, 221, 231, and 241 (refer to FIG. 5 ), thefirst and second connection patterns 212 and 222 (refer to FIG. 5 ), theisland pattern 232-11 (refer to FIG. 7 ), the dummy electrodes 291, 292,293, and 294 (refer to FIGS. 7 and 8 ), the first connection electrode233 (refer to FIG. 8 ), and the second connection electrode 243 (referto FIG. 8 ).

The second conductive layer includes a transparent conductive oxide. Forexample, the second conductive layer includes at least one of indium tinoxide (ITO), indium zinc oxide (IZO), indium gallium oxide (IGO), indiumgallium zinc oxide (IGZO), and mixtures/compounds thereof. However, thesecond conductive layer should not be limited thereto or thereby.

The second insulating layer 201L2 covers the second conductive layer.The second insulating layer 201L2 includes an organic material and/or aninorganic material and has a single-layer or multi-layer structure. Inthe exemplary embodiment of the present disclosure, the secondinsulating layer 201L2 has the single-layer structure of silicon oxide.

FIG. 10 is a cross-sectional view showing a display module 1200 aaccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 10 , the display module 1200 a includes a displaypanel 100 a and an input sensor 200 a.

The display panel 100 a includes a base substrate 100-1, a circuit layer100-2, a display element layer 100-3, and an encapsulation layer 100-4a. The circuit layer 100-2 is disposed on the base substrate 100-1, thedisplay element layer 100-3 is disposed on the circuit layer 100-2, andthe encapsulation layer 100-4 a is disposed on the display element layer100-3.

Recessed portions 171 and 172 are defined in the first area 101. Each ofthe recessed portions 171 and 172 is defined to surround an edge of amodule hole 1220. The recessed portions 171 and 172 block a path throughwhich moisture or oxygen introduced through the module hole 1220 entersinto the pixel 110. The recessed portions 171 and 172 are defined byremoving some of components forming the display panel 100 a. FIG. 10shows two recessed portions 171 and 172 as a representative example.However, the number of the recessed portions 171 and 172 should not belimited thereto or thereby.

A dam portion 181 is disposed between the recessed portions 171 and 172.FIG. 10 shows one dam portion 181 as a representative example. However,the number of the dam portions 181 should not be limited to one. The damportion 181 has a stacked structure of predetermined insulating layers.However, the number of the insulating layers forming the dam portion 181may be changed in various ways. The dam portion 181 prevents an organiclayer 72 described below from expanding.

The encapsulation layer 100-4 a is disposed on the display element layer100-3 and encapsulates the light-emitting device 114. Meanwhile,although not shown in figures, a capping layer is further disposedbetween the second electrode CE and the encapsulation layer 100-4 a tocover the second electrode CE.

The encapsulation layer 100-4 a includes a first inorganic layer 71, anorganic layer 72, and a second inorganic layer 73, which aresequentially stacked in the third direction DR3. However, theencapsulation layer 100-4 a should not be limited thereto or thereby.The encapsulation layer may further include a plurality of inorganiclayers and a plurality of organic layers.

The first inorganic layer 71 covers the second electrode CE. The firstinorganic layer 71 prevents external moisture or oxygen from enteringthe light-emitting device 114. For example, the first inorganic layer 71includes silicon nitride, silicon oxide, or a combination thereof. Thefirst inorganic layer 71 is formed by a chemical vapor depositionprocess.

The organic layer 72 is disposed on the first inorganic layer 71 andcontacts the first inorganic layer 71. The organic layer 72 provides aflat surface on the first inorganic layer 71. An uneven shape formed onthe upper surface of the first inorganic layer 71 or particles locatedon the first inorganic layer 71 is covered by the organic layer 72.Therefore, influence of a surface state of the upper surface of thefirst inorganic layer 71, which is exerted on components formed on theorganic layer 72, is blocked. Additionally or alternatively, the organiclayer 72 relieves stress between layers contacting each other. Theorganic layer 72 includes an organic material and is formed by asolution process, such as a spin coating, a slit coating, or an inkjetprocess.

The second inorganic layer 73 is disposed on the organic layer 72 tocover the organic layer 72. The second inorganic layer 73 is stablyformed on a relatively flat surface than being disposed on the firstinorganic layer 71. The second inorganic layer 73 encapsulates moistureleaked from the organic layer 72 to prevent the moisture from flowing tothe outside. The second inorganic layer 73 includes silicon nitride,silicon oxide, or a compound thereof. A chemical vapor depositionprocess forms the second inorganic layer 73.

The cover portion 80 is disposed in the first area 101. The coverportion 80 covers an uneven surface caused by the dam portion 181 or therecessed portions 171 and 172 and defines an even surface.

The input sensor 200 a includes a plurality of insulating layers 201L0,201L1, and 201L2 and a plurality of conductive layers. The insulatinglayers 201L0, 201L1, and 201L2 include a base insulating layer 201L0, afirst insulating layer 201L1, and a second insulating layer 201L2.

The base insulating layer 201L0 is an inorganic layer containing one ofsilicon nitride, silicon oxynitride, and silicon oxide. Additionally oralternatively, the base insulating layer 201L0 is an organic layercontaining an epoxy resin, an acryl resin, or an imide-based resin. Thebase insulating layer 201L0 is formed directly on the display panel 100a. The base insulating layer 201L0 has a single-layer or multi-layerstructure.

The first conductive layer is disposed on the base insulating layer201L0. The first conductive layer includes the first and second bridgepatterns 232-22 and 232-33 (refer to FIG. 7 ), the first sensing lines250 (refer FIG. 5 ), the second sensing lines 261 and 262 (refer to FIG.5 ), and the ground lines 271 and 272 (refer to FIG. 5 ).

The first insulating layer 201L1 covers the first conductive layer. Thefirst insulating layer 201L1 includes an organic material and/or aninorganic material and has a single-layer or multi-layer structure.

The second conductive layer is disposed on the first insulating layer201L1. The second conductive layer includes the first, second, third,and fourth sensing patterns 211, 221, 231, and 241 (refer to FIG. 5 ),the first and second connection patterns 212 and 222 (refer to FIG. 5 ),the island pattern 232-11 (refer to FIGS. 7 and 8 ), the dummyelectrodes 291, 292, 293, and 294 (refer to FIG. 8 ), the firstconnection electrode 233 (refer to FIG. 6 ), and the second connectionelectrode 243 (refer to FIG. 6 ).

The second insulating layer 201L2 covers the second conductive layer.The second insulating layer 201L2 includes an organic material and/or aninorganic material and has a single-layer or multi-layer structure.

FIG. 11 is a cross-sectional view showing a display module 1200 baccording to an exemplary embodiment of the present disclosure.

Referring to FIG. 11 , the display module 1200 b includes a displaypanel 100 b and an input sensor 200 b. As compared with FIG. 10 , thehole 1220 (refer to FIG. 10 ) is not defined in the display panel 100 band the input sensor 200 b. Additionally or alternatively, atransmissive area 1220-1 is defined in the display panel 100 b and theinput sensor 200 b.

The transmissive area 1220-1 has a relatively higher transmittance thanthe second area 102 (refer to FIG. 3 ). The transmissive area 1220-1 isa space through which external signals input to the electronic modules1300 (refer to FIG. 2 ) or signals output from the electronic modules1300 (refer to FIG. 2 ) are transmitted.

In the present exemplary embodiment, a second electrode CE is formed tooverlap the transmissive area 1220-1. When the second electrode CE is atransmissive or transflective electrode, the transmissive area 1220-1has a relatively higher transmittance than the area in which the pixel110 is disposed even though the second electrode CE overlaps thetransmissive area 1220-1.

The transmissive area 1220-1 has a shape corresponding to the hole 1220in a plane. For example, the transmissive area 1220-1 has one of acircular shape, an oval shape, a polygonal shape, and a polygonal shapewith a curved side on at least one side thereof in the plan view.However, the transmissive area 1220-1 should not be particularly limitedto the exemplary shapes.

Although the exemplary embodiments of the present disclosure have beendescribed, it is understood that the present disclosure should not belimited to these exemplary embodiments, but various changes andmodifications can be made by one ordinary skilled in the art within thespirit and scope of the present disclosure as hereinafter claimed.Therefore, the disclosed subject matter should not be limited to anysingle embodiment described herein, and the scope of the presentinventive concept shall be determined according to the attached claims.

What is claimed is:
 1. An electronic apparatus comprising: a displaypanel; and an input sensor disposed on the display panel, comprisingunit sensor areas arranged in a first direction and a second direction,and comprising sensing patterns and connection patterns electricallyconnecting the sensing patterns, wherein a hole is defined through thedisplay panel and the input sensor, wherein the unit sensor areascomprise a first unit sensor area overlapping the hole and a second unitsensor area not overlapping the hole, wherein a first connection patterndisposed in the first unit sensor area among the connection patternsdoes not overlap the hole and is disposed in an area of the first unitsensor area spaced apart from a first center of the first unit sensorarea, and wherein a second connection pattern disposed in the secondunit sensor area among the connection patterns is disposed at a secondcenter of the second unit sensor area.
 2. The electronic apparatus ofclaim 1, wherein a width in the first direction of the hole is greaterthan a width in the second direction of the hole.
 3. The electronicapparatus of claim 1, wherein the input sensor further comprises a firstconnection electrode surrounding the hole entirely, wherein the sensingpatterns comprise a first sensing pattern and a second sensing patternspaced apart from the first sensing pattern in the second direction suchthat the hole is disposed between the first and second sensing patterns,and the first sensing pattern and the second sensing pattern areelectrically connected to each other by the first connection electrode.4. The electronic apparatus of claim 3, wherein the input sensor furthercomprises a second connection electrode surrounding a portion of thehole and spaced apart from the hole such that the first connectionelectrode is disposed between the hole and the second connectionelectrode, wherein the sensing patterns further comprise a third sensingpattern and a fourth sensing pattern spaced apart from the third sensingpattern in the second direction such that the hole is disposed betweenthe third sensing pattern and the fourth sensing pattern, and the thirdsensing pattern and the fourth sensing pattern are electricallyconnected to each other by the second connection electrode.
 5. Theelectronic apparatus of claim 4, wherein the input sensor furthercomprises: a first dummy electrode disposed adjacent to the firstconnection electrode; and a second dummy electrode disposed adjacent tothe second connection electrode, wherein the first dummy electrode has awidth equal to or greater than a width of the first connectionelectrode, and the second dummy electrode has a width equal to orgreater than a width of the second connection electrode.
 6. Theelectronic apparatus of claim 1, wherein the unit sensor areas furthercomprise a third unit sensor area overlapping the hole, the first centerof the first unit sensor area overlaps the hole, a third center of thethird unit sensor area does not overlap the hole, and a third connectionpattern disposed in the third unit sensor area among the connectionpatterns is disposed at the third center of the third unit sensor area.7. The electronic apparatus of claim 1, wherein the input sensor furthercomprises a bypass pattern connected to one second sensing pattern oftwo second sensing patterns arranged in the second direction among thesensing patterns, wherein each of the connection patterns comprises aconnection pattern connecting two first sensing patterns arranged in thefirst direction, an island pattern disposed between the two secondsensing patterns and spaced apart from the connection pattern, a firstbridge pattern connected to the island pattern and one of the two secondsensing patterns, and a second bridge pattern connected to the islandpattern and another of the two second sensing patterns, and the bypasspattern has a length shorter than a length of the first bridge pattern.8. An electronic apparatus comprising: a display panel; and an inputsensor disposed on the display panel, comprising unit sensor areasarranged in a first direction and a second direction, and comprisingsensing patterns, connection patterns electrically connecting thesensing patterns, and a first connection electrode, wherein a hole isdefined through the display panel and the input sensor, and wherein thefirst connection electrode surrounding the hole, wherein the sensingpatterns comprise a first sensing pattern and a second sensing patternspaced apart from the first sensing pattern in the second direction suchthat the hole is disposed between the first and second sensing patterns,and the first sensing pattern and the second sensing pattern areelectrically connected to each other by the first connection electrode.9. The electronic apparatus of claim 8, wherein the input sensor furthercomprises a second connection electrode surrounding a portion of thehole and spaced apart from the hole such that the first connectionelectrode is disposed between the hole and the second connectionelectrode, wherein the sensing patterns further comprise a third sensingpattern and a fourth sensing pattern spaced apart from the third sensingpattern in the second direction such that the hole is disposed betweenthe third sensing pattern and the fourth sensing pattern, and the thirdsensing pattern and the fourth sensing pattern are electricallyconnected to each other by the second connection electrode.
 10. Theelectronic apparatus of claim 9, wherein the input sensor furthercomprises: a first dummy electrode disposed adjacent to the firstconnection electrode; and a second dummy electrode disposed adjacent tothe second connection electrode, wherein the first dummy electrode has awidth equal to or greater than a width of the first connectionelectrode, and the second dummy electrode has a width equal to orgreater than a width of the second connection electrode.
 11. Theelectronic apparatus of claim 8, wherein the unit sensor areas comprisea first unit sensor area overlapping the hole and a second unit sensorarea not overlapping the hole, wherein a first connection patterndisposed in the first unit sensor area among the connection patternsdoes not overlap the hole and is disposed in an area of the first unitsensor area spaced apart from a first center of the first unit sensorarea, and wherein a second connection pattern disposed in the secondunit sensor area among the connection patterns is disposed at a secondcenter of the second unit sensor area.
 12. The electronic apparatus ofclaim 8, wherein a width in the first direction of the hole is greaterthan a width in the second direction of the hole.
 13. An electronicapparatus comprising: a display panel; and an input sensor disposed onthe display panel, comprising unit sensor areas arranged in a firstdirection and a second direction, and comprising sensing patterns andconnection patterns electrically connecting the sensing patterns,wherein a hole is defined through the display panel and the inputsensor, wherein the unit sensor areas comprise a first unit sensor areaoverlapping the hole and a second unit sensor area overlapping the hole,wherein a first connection pattern disposed in the first unit sensorarea among the connection patterns does not overlap the hole and isdisposed in an area of the first unit sensor area spaced apart from afirst center of the first unit sensor area, wherein a second connectionpattern disposed in the second unit sensor area among the connectionpatterns is disposed at a second center of the second unit sensor area,and wherein the first center of the first unit sensor area overlaps thehole, the second center of the second unit sensor area does not overlapthe hole.